Thermally conductive polyimide film ensures efficient heat dissipation, excellent thermal stability, and reliable dielectric properties. Ideal for power electronics, LED substrates, automotive systems, and high-temperature thermal management applications.
| ITEM | TF02MT25 | TF02MT38 | TF02MT50 |
| Thickness mm | 0.025 | 0.038 | 0.05 |
| Tensile strength Mpa MD/TD | 115/85 | 100/85 | 95/85 |
| Elongation % MD/TD | 26/27 | 29/28 | 30/30 |
| Heat contraction rate 230°C % MD/TD | <0.20 / <0.15 | <0.20 / <0.15 | <0.20 / <0.15 |
| Electrical Operating Frequency intensityMv/m | ≥110 | ≥110 | ≥130 |
| Thermal conductivity W/(m.K) | ≥0.7 | ≥0.7 | ≥0.7 |
