Ultra-thin polyimide film offers exceptional flexibility, high thermal stability, and reliable dielectric strength. Ideal for compact flexible circuits, microelectronics, sensors, and high-density electronic devices requiring space efficiency.
| ITEM | UNIT | TFB6051#5.0 | TFB6051#7.5 |
| Thickness | μm | 18 | 20 |
| Thickness tolerance | μm | ±0.3 | ±0.3 |
| Tensile strength | MPa | 220 | 230 |
| Elongation | % | 30 | 30 |
| Volume resistivity | Ω·cm | 4.5×1013 | 4.5×1013 |
| Surface resistivity | Ω | 3×1015 | 3×1015 |
| Insulation strength | V/μm | 250 | 250 |
| Heat-Shrinking rate200℃，2Hr | % | 0.08 | 0.08 |
